基于AFM-IR的电子铜箔表面痕量有机物的原位检测与去除  

In-Suit Detection and Removal of Trace Organics on the Surface of Electronic Copper Foils by AFM-IR

作　　者：李林玲 王勇 印大维 章晨 滕超 陈葳[3] 江伟[3] 李大双 郑小伟 周东山 薛奇 LI Linling;WANG Yong;YIN Dawei;ZHANG Chen;TENG Chao;CHEN Wei;JIANG Wei;LI Dashuang;ZHENG Xiaowei;ZHOU Dongshan;XUE Qi(Institute of Critical Materials for Integrated Circuits,Shenzhen Polytechnic University,Shenzhen 518055,China;Anhui Tongguan Copper Foil Group Co.,Ltd.,Chizhou 247100,China;School of Chemistry and Chemical Engineering,Nanjing University,Nanjing 210023,China)

机构地区：[1]深圳职业技术大学集成电路关键材料研究院,广东深圳518055 [2]安徽铜冠铜箔集团股份有限公司,安徽池州247100 [3]南京大学化学化工学院,南京210023

出　　处：《电子与封装》2025年第4期5-12,共8页Electronics & Packaging

基　　金：国家自然科学基金原创探索计划(52350346);广东省普通高校工程技术中心项目(2023GCZX015)。

摘　　要：高性能电子铜箔是新一代通信技术所用高频高速PCB板的核心原材料之一,铜电沉积后表面吸附有机添加剂的控制对电子铜箔的性能有重要影响。基于原子力显微-红外光谱(AFM-IR)技术极高的检测灵敏度和空间分辨率,原位检测到国产铜箔表面残留的痕量有机杂质为整平剂明胶,并通过铜箔表面化学成像分析,发现这些残留的整平剂以零星状吸附于铜瘤顶部和侧面的钝化层之上。在AFM-IR方法的监测下,对二氯甲烷溶剂洗涤去除铜箔表面残留痕量有机杂质的效率进行了定量分析。相关工作将会有助于铜箔表面处理工艺的优化,以实现国产电子铜箔的高性能化。High-performance electronic copper foil is one of the core raw materials for high-frequency and high-speed PCB used in new-generation communication technologies.The control of adsorbed organic additives on the surface after copper electrodeposition has an important influence on the performance of electronic copper foil.Based on the extremely high detection sensitivity and spatial resolution of the atomic force microscopy-based infrared spectroscopy(AFM-IR)technique,the trace organic additives remaining on the surface of domestic copper foil are detected in situ as the leveling agent gelatin,and analyzed by the copper foil surface chemical imaging,which reveals that these residual leveling agents are adsorbed in a sporadic manner on top and side of the passivation layer of the copper tumors.The efficiency of dichloromethane solvent washing to remove residual trace organic impurities remaining on the surface of copper foils is quantitatively analyzed under the monitoring of AFM-IR method.The related work will contribute to the optimization of the surface treatment process of copper foil and the realization of high performance of domestic electronic copper foil.

关 键 词：原子力显微-红外光谱 铜箔 痕量有机物检测 表面处理 PCB 

分 类 号：O656.21[理学—分析化学] TN41[理学—化学]