电子灌封胶研究进展  

Research progress on electronic encapsulants

作　　者：王晓卫 黄国平 勾文哲 陈科科 刘颖潇 WANG Xiaowei;HUANG Guoping;GOU Wenzhe;CHEN Keke;LIU Yingxiao(Shenzhen Institute for Advanced Study,University of Electronic Science and Technology of China,Shenzhen 518028,China;Shenzhen Zhenhua Microelectronics Co.,Ltd.,Shenzhen 518057,China)

机构地区：[1]电子科技大学(深圳)高等研究院,广东深圳518028 [2]深圳市振华微电子有限公司,广东深圳518057

出　　处：《粘接》2025年第5期17-21,共5页Adhesion

摘　　要：随着电力电子元件向高功率小型化的趋势发展,电子器件对电子灌封胶提出更高的性能要求。环氧树脂灌封胶、聚氨酯灌封胶和有机硅灌封胶导热能力良好、绝缘性优异、热膨胀系数低、黏度小、阻燃能力强,且具有强度、硬度、韧度和耐温耐候等可靠的综合性能,备受电子行业关注,已广泛应用于电子元器件领域。开发“导热优、强度高、韧度好、综合性能强”的高性能电子灌封胶已成为当前研究的重点和热点。综述了电子灌封胶的研究进展,介绍了电子灌封胶的种类,并详细阐述了电子灌封胶的性能调控方法及应用,对电子灌封胶未来的研究发展方向提出见解。With the development of power electronic components to high-power miniaturization,electronic devices put forward higher performance requirements for electronic potting compounds.Epoxy resin potting compound,polyurethane potting compound and silicone potting compound have good thermal conductivity,excellent insulation,low thermal expansion coefficient,low viscosity,strong flame retardant ability,and have reliable comprehensive properties such as strength,hardness,toughness,temperature and weather resistance,etc.,which have attracted the attention of the electronics industry and have been widely used in the field of electronic components.The development of high-performance electronic potting adhesives with“excellent thermal conductivity,high strength,good toughness and strong comprehensive performance”has become the focus and hot spot of current research.This paper reviews the research progress of electronic potting compounds,introduces the types of electronic potting compounds,and elaborates the performance control methods and applications of electronic potting compounds,and puts forward insights on the future research and development direction of electronic potting compounds.

关 键 词：电子灌封胶 环氧树脂灌封胶 聚氨酯灌封胶 有机硅灌封胶 综合性能 

分 类 号：TQ433.437[化学工程]