黏结促进剂对电子封装环氧模塑料与镀镍基材黏附性的影响  

Effect of adhesion promoters on adhesion of epoxy molding compounds for electronic packaging with nickel-plated substrates

作　　者：朱飞宇 胡伟 费小马 李小杰 刘敬成 魏玮 ZHU Feiyu;HU Wei;FEI Xiaoma;LI Xiaojie;LIU Jingcheng;WEI Wei(Key Laboratory of Synthetic and Biological Colloids,Ministry of Education,School of Chemical and Material Engineering,Jiangnan University,Wuxi 214122,China;Wuxi Chuangda Advanced Materials Co.,Ltd.,Wuxi 214028,China)

机构地区：[1]江南大学化学与材料工程学院,合成与生物胶体教育部重点实验室,江苏无锡214122 [2]无锡创达新材料股份有限公司,江苏无锡214028

出　　处：《热固性树脂》2025年第2期34-40,共7页Thermosetting Resin

基　　金：2018年江苏省产学研合作项目(BY2018041)。

摘　　要：提高环氧模塑料(EMC)与镀镍引线框架的黏附力一直是电子封装材料领域的研究热点。本文分别以3-氨基-5-巯基-1,2,4-三氮唑、5-氨基四氮唑、肌醇六(巯基丙酸酯)、偏苯三甲酸和没食子酸为黏结促进剂制备了EMC,考察了黏结促进剂对EMC的成型及其固化物的热机械性能和力学性能的影响,并采用水接触角测试表征了不同黏结促进剂对镀镍基材表面的修饰行为,推测了可能的黏附机理。结果表明,上述5种化合物的加入均能有效提高EMC与镀镍基材的黏附力,其中没食子酸的效果最为显著,使黏附力达到了480 N。一方面,黏结促进剂参与了环氧基体树脂的固化反应,使固化网络的交联密度有所下降,降低了材料的玻璃化转变温度和弯曲强度。另一方面,粘附促进剂和镀镍基材之间存在潜在的氢键相互作用有效改变了镍表面,并改善了其对EMC的润湿行为。因此,这些具有多种活性氢结构的化合物在粘合界面上起着“桥接”作用,对EMC和镀镍基板之间的粘合具有显著的促进作用。Improving the adhesion between epoxy molding compound(EMC)and nickel-plated lead frames has always been a hot topic in the field of electronic packaging materials.In this study,3-amino-5-mercapto-1,2,4-triazole,5-amino-tetrazole,inositol hexa(3-mercaptopropionate),trimellitic anhydride,and gallic acid were used as adhesion promoters to prepare EMC formulations.The influence of the adhesion promoters on the molding of EMC,as well as the thermal-mechanical and mechanical properties of its cured materials was examined.The water contact angle tests were used to characterize the surface modification behavior of different adhesion promoters on nickel-plated substrates,and possible adhesion mechanisms were speculated.The results showed that the addition of these five compounds effectively improved the adhesion between EMC and nickel-plated substrates,with gallic acid having the most significant effect by increasing adhesion to 480 N.On one hand,the adhesion promoters can participate in the curing reaction of epoxy resin matrix,reducing crosslink density of cured networks which lowers glass transition temperature and flexural strength.On the other hand,potential hydrogen bond interactions exist between the adhesion promoters and nickel-plated substrates,which effectively modifies nickel surface and improves its wetting behavior towards EMC.Therefore,these compounds with multiple active hydrogen structures play a"bridging"role at adhesive interfaces,showing significant promotion effects for adhesion between EMC and nickel-plated substrates.

关 键 词：环氧模塑料 黏结促进剂 镀镍基材 电子封装 黏附性 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]