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作 者:许鹏 聂靖宇 王伟忠 李保岭 Xu Peng;Nie Jingyu;Wang Weizhong;Li Baoling(MT Microsystems Co.,Ltd.,Shijiazhuang 050200,China;The 13th Research Institute,CETC,Shijiazhuang 050051,China)
机构地区:[1]河北美泰电子科技有限公司,石家庄050200 [2]中国电子科技集团公司第十三研究所,石家庄050051
出 处:《微纳电子技术》2025年第5期80-86,共7页Micronanoelectronic Technology
摘 要:为了延长电动汽车的续航能力,热泵空调系统逐渐取代了传统的正温度系数(PTC)热敏电阻空调,应用于热泵空调系统的压力温度传感器是系统控制的关键部件。基于一款可以直接接触冷媒的微电子机械系统(MEMS)压阻式压力芯片,采用无引线倒装焊封装工艺,结合模块化装配的设计思路,开发了一款应用于汽车空调系统的压力温度传感器,并通过仿真手段证明了传感器的结构可靠性。通过对传感器进行测试,传感器的压力精度可以达到全温区±0.5%Vcc(Vcc为传感器供电电压),过载压力可达6 MPa,破裂压力达10 MPa。寿命测试后,传感器的误差范围依旧在±1%Vcc内。同时,传感器通过了功能测试和可靠性测试,应用前景广阔。To extend the endurance of electric vehicles,heat pump air conditioning systems are gradually replacing traditional positive temperature coefficient(PTC)resistance air conditioning systems,and the pressure and temperature sensor applied to the heat pump air conditioning system is the key component of the system control.Based on a micro-electromechanical system(MEMS)piezoresistive pressure chip that can contact the refrigerant directly,a pressure and temperature sensor for automotive air conditioning system was developed by leadless flip-chip welding packaging technology and combining with the design idea of modular assembly.Structural reliability of the sensor was verified by simulation.By testing the sensor,the sensor achieves a pressure accuracy of±0.5%Vcc(Vcc is the sensor supply voltage)across the full temperature range,an overload pressure of 6 MPa and a burst pressure of 10 MPa.After the life test,the error range of the sensor is still within±1%Vcc.Meanwhile,the sensor has passed functional test and reliability test and has a broad application prospect.
关 键 词:热泵空调系统 压力温度传感器 模块化装配 压阻式微电子机械系统(MEMS) 无引线封装
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