导电胶粘接片式元件接触电阻可靠性研究  

Research on the Reliability of Contact Resistance of Electrically Conductive Adhesive Bonding Chip Components

作　　者：史海林 刘家龙 弓明杰 王攀 卢朝阳 关超 Shi Hailin;Liu Jialong;Gong Mingjie;Wang Pan;Lu Zhaoyang;Guan Chao(The 771^(st)Research Institute,The 9th Research Institute,China Aerospace Science and Technology Corporation,Xi'an 710119,China)

机构地区：[1]中国航天科技集团有限公司第九研究院第七七一研究所,西安710119

出　　处：《微纳电子技术》2025年第5期112-116,共5页Micronanoelectronic Technology

摘　　要：为验证导电胶粘接片式元件接触电阻可靠性,制备自动粘接和人工粘接样品,以高温老化、环境试验、机械试验作为考核条件,研究了导电胶粘接片式元件接触电阻可靠性。研究结果表明,采用自动粘接工艺的导电胶接触电阻在考核前后的一致性优于人工粘接工艺。经过168h/125℃和1000h/125℃老化后,自动粘接与人工粘接工艺的导电胶接触电阻分别增加约5%和20%;经过环境试验及机械试验后,自动粘接工艺导电胶接触电阻增加20%左右,人工粘接工艺导电胶接触电阻增加30%左右。In order to verify the reliability of contact resistance of electrically conductive adhesive bonding chip components,automatic bonding and manual bonding samples were prepared.The high-temperature aging,environmental testing and mechanical testing were used as assessment conditions to study the reliability of contact resistance of electrically conductive adhesive bonding chip components.The research results indicate that the consistency of contact resistance of electrically conductive adhesive by using automatic bonding process is better than that of manual bonding process before and after assessment.After aging at 168 h/125℃and 1000 h/125℃,the contact resistances of the electrically conductive adhesive for automatic bonding and manual bonding processes increase by about 5%and 20%,respectively.After environmental and mechanical tests,the contact resistance of the electrically conductive adhesive in the automatic bonding process increases by about 20%,and the contact resistance of the electrically conductive adhesive in the manual bonding process increases by about 30%.

关 键 词：接触电阻 导电胶 粘接 可靠性 片式元件 

分 类 号：TN406[电子电信—微电子学与固体电子学]