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作 者:孙磊[1,2] 何鹏[2] 张亮[3] 张墅野 王文昊[1] 张潘杰 SUN Lei;HE Peng;ZHANG Liang;ZHANG Shuye;WANG Wenhao;ZHANG Panjie(School of Mechanical Engineering and Rail Transit,Changzhou University,Changzhou 213164,Jiangsu,China;State Key Laboratory of Precision Welding&Joining of Materials and Structures,Harbin Institute of Technology,Harbin 150001,China;School of Materials Science and Engineering,Xiamen University of Technology,Xiamen 361024,Fujian,China)
机构地区:[1]常州大学机械与轨道交通学院,江苏常州213164 [2]哈尔滨工业大学材料结构精密焊接与连接全国重点实验室,哈尔滨150001 [3]厦门理工学院材料科学与工程学院,福建厦门361024
出 处:《材料导报》2025年第10期143-146,共4页Materials Reports
基 金:国家自然科学基金(52305338;U21A20128);江苏省自然科学基金(BK20210853);中国博士后科学基金(2023M741485);江苏省青年科技人才托举工程(JSTJ-2024-027);常州市科技计划项目(CJ20230033)。
摘 要:通过接触角测量仪、万能拉伸试验机以及扫描电镜(SEM)等测试方法,研究了Sn-xTiN(x=0,0.05,0.1,0.2,0.3,0.4,质量分数,%)焊点的润湿性、力学性能以及微观组织。结果表明,在Sn钎料中加入TiN纳米颗粒后,钎料的润湿性得到显著提高,焊点的力学性能也得到增强。当TiN纳米颗粒的加入量达到0.2%时,钎料的润湿角由初始的16.5°下降到13.8°,降幅为16.4%,焊点的剪切强度提高24.0%。对于微观组织,随着TiN纳米颗粒的加入,Sn-xTiN/Cu焊点界面金属间化合物(IMC)的厚度由初始的6.5μm下降到5.8μm。继续增加TiN纳米颗粒的加入量,焊点界面IMC厚度则会逐渐上升。The wettability,mechanical properties and microstructure of Sn-xTiN(x=0,0.05,0.1,0.2,0.3,0.4,mass fraction,%)solder were stu-died by contact angle measuring instrument,universal testing machine and scanning electron microscopy(SEM).The results show that the wettability and the mechanical properties of the Sn solder joint are enhanced significantly by adding TiN nanoparticles.When the addition content of TiN nanoparticles reaches 0.2%,the contact angle of the solder decreases from the initial 16.5°to 13.8°,a decrease of 16.4%,and the shear strength of solder joint increases by 24.0%.For microstructures,the thickness of intermetallic compound(IMC)in Sn-xTiN/Cu solder joints decreases from the initial 6.5μm to 5.8μm with the addition of TiN nanoparticles.However,the interfacial IMC thickness of solder joints gradually increases with the addition of TiN nanoparticles.
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