半导体制造业用碳化硅制备工艺研究与实践  

Research and Practice of Silicon Carbide Preparation Process for Semiconductor Manufacturing Industry

作　　者：徐生龙[1] 冶艳 白璐璐 廉泽宁 Xu Shenglong;Ye Yan;Bai Lulu;Lian Zening(Wuwei Vocational College,Wuwei,Gansu 733000,CHN)

机构地区：[1]武威职业学院,甘肃武威733000

出　　处：《模具制造》2025年第5期243-245,共3页Die & Mould Manufacture

基　　金：甘肃省科技厅2024年度第八批省级科技计划(技术创新引导计划)项目“大数据背景下高品质碳化硅(SiC)生产工艺优化”(24CXGH001)。

摘　　要：碳化硅制备工艺对于生产高质量碳化硅晶圆有着直接影响,目前碳化硅晶圆被应用到了各个高新领域之中,是制作高新产品的重要材料之一。但由于碳化硅制备工艺仍然较为落后,这一定程度影响了科技的发展。因此,半导体制造业一定要深入研究碳化硅制备工艺,进一步提升制备水平,这样才能生产更多、更高质量的碳化硅。阐述了半导体制造业的趋势,分析了半导体制造业碳化硅制备工艺的研究情况,并对目前的制备工艺研究开展了分析阐述,希望能为相关从业者开展工作提供一定的理论依据。The silicon carbide preparation process has a direct impact on the production of highquality silicon carbide wafers,and silicon carbide wafers are currently used in various high-tech fields and are one of the important materials for the production of high-tech products.However,due to the fact that the preparation process of silicon carbide is still relatively backward,this has affected the development of science and technology to a certain extent.Therefore,the semiconductor manufacturing industry must deeply study the silicon carbide preparation process and further improve the preparation level,so as to produce more and higher quality silicon carbide.This research expounds the trend of the semiconductor manufacturing industry,analyzes the research of silicon carbide preparation process in semiconductor manufacturing industry,and analyzes and expounds the current preparation process research,hoping to provide a certain theoretical basis for relevant practitioners to carry out their work.

关 键 词：半导体 碳化硅 制备工艺 

分 类 号：TQ12[化学工程—无机化工]