基于有限元分析法的陶瓷-金属封接结构改进  

Structure Improvement of Ceramic-Metal Sealing Based on Finite Element Analysis

作　　者：徐玉茹 苏旭红 黄仁华 于志强[1] XU Yu-ru;SU Xu-hong;HUANG Ren-hua;YU Zhi-qiang(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)

机构地区：[1]北京真空电子技术研究所,北京100015

出　　处：《真空电子技术》2025年第2期17-20,共4页Vacuum Electronics

摘　　要：基于有限元分析法,对陶瓷-金属封接件进行封接应力仿真分析,结果表明将封接件的直接封接结构改为挠性封接结构,并减薄焊缝区金属件的壁厚,能使陶瓷上的最大封接应力降低35.8%。对改进结构后的封接件进行3次热循环试验,仍能保持良好的气密性,漏气率不大于1×10^(-9) Pa·m^(3)·s^(-1)。The stress of ceramic-metal sealing is simulated and analyzed based on finite element analysis method.The results show that the maximum stress on ceramics can be reduced by 35.8%by changing direct sealing structure to flexible sealing structure and by reducing the wall thickness of metal parts in the welding zone.After three times of thermal cycle test,the ceramic-metal sealing can still maintain good gas tightness,and the leakage rate is≤1×10^(-9) Pa·m^(3)·s^(-1).

关 键 词：封接应力 有限元分析 陶瓷-金属封接 

分 类 号：TN105[电子电信—物理电子学] TN103