不同焊料封接陶瓷/金属的强度对比和界面微观分析  

Sealing Strength Comparison and Interface Microscopic Analysis of Ceramic/Metal Sealing with Different Solders

作　　者：苏旭红 徐玉茹 尚阿曼[1] 黄亦工[1] 于志强[1] SU Xu-hong;XU Yu-ru;SHANG A-man;HUANG Yi-gong;YU Zhi-qiang(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)

机构地区：[1]北京真空电子技术研究所,北京100015

出　　处：《真空电子技术》2025年第2期47-52,共6页Vacuum Electronics

摘　　要：对比了采用不同焊料焊接陶瓷与金属(可伐和无氧铜)的封接强度。采用扫描电子显微镜(SEM)对封接界面微观形貌和成分进行了分析,通过ANSYS软件仿真分析了陶瓷与不同金属封接时的应力分布。结果表明,选用AuNi17.5焊料时,陶瓷与两种金属封接的抗拉强度均低于90 MPa,断裂模式为Mo-Mo分层;采用同种焊料(AuNi17.5除外)时,陶瓷-无氧铜的封接强度比陶瓷-可伐的封接强度高10%~20%。通过应力仿真发现材料本征的力学性能会影响封接应力的分布状态,进而决定封接强度。The sealing strengths of ceramics and different metals(Kovar and oxygen-free copper)welded with different solders are compared.The microstructure and composition of the sealing interface are analyzed by scanning electron microscopy(SEM),and the stress distribution is analyzed by ANSYS simulation.The result shows that the tensile strength of ceramic and the two metals sealed with AuNi 17.5 solder is lower than 90 MPa,and the fracture mode is Mo-Mo delamination.The sealing strength of ceramic/oxygen-free copper is 10%~20%higher than that of ceramic/Kovar when using same solders(excepting AuNi 17.5).Through stress simulation,it is found that the intrinsic mechanical properties of materials affects the distribution of sealing stress,and then determines the sealing strength.

关 键 词：陶瓷-金属封接 抗拉强度 焊料选择 界面应力 有限元仿真 

分 类 号：TN105[电子电信—物理电子学]