添加剂的整平能力及其对Cu电沉积层结构的影响  

Leveling Ability of Additives and Their Effects on Structure of Cu Electrodeposits

作　　者：杨防祖[1] 黄令[1] 许书楷[1] 姚士冰[1] 陈秉彝[1] 周绍民[1] 

机构地区：[1]厦门大学化学系固体表面物理化学国家重点实验室物理化学研究所,福建厦门361005

出　　处：《厦门大学学报（自然科学版）》2003年第1期56-59,共4页Journal of Xiamen University：Natural Science

基　　金：国家自然科学基金(20073037);优秀国家重点实验室基金(20013001)资助项目

摘　　要：采用电化学、X射线衍射和扫描电镜方法研究酸性镀铜过程中添加剂的整平能力及其对Cu电沉积层结构和表面形貌的影响.结果表明,采用本文所研制的添加剂,可以获得光亮、致密且整平能力可达到100%的Cu电沉积层;所获得的Cu镀层均不存在明显的晶面择优取向现象.镀液中光亮剂单独存在及其与整平剂共存时,镀层表面分别呈现晶粒细小致密形貌和网状结构.Leveling ability of additives and their effects on the structure and surface morphology of Cu electrodeposited in acidic electrolyte solution were studied by means of electrochemistry, XRD and SEM. The results showed that bright and tidy Cu electrodeposit in 100% leveling ability could be obtained from the electrolyte solution with the developed additives. The structure of the all obtained copper deposits were shown in obvious nonpreferred orientation. The surface morphology of Cu deposits were respectively presented in fine and tidy grains and net state when the brightener in bath was existed alone and coexisted with leveling agent.

关 键 词：电沉积层 Cu镀层 添加剂 整平能力 铜电镀 镀层结构 

分 类 号：TQ153.14[化学工程—电化学工业]