高结合力半光亮化学浸铜工艺研究  

High Adhesive Semibright Immersion Copper-Plating Process

作　　者：方景礼[1] 宋文宝[2] 潘梅剑 叶向荣[1] 陈玉銮[1] 刘琴[2] 

机构地区：[1]南京大学应用化学研究所 [2]南京化工学院应用化学系

出　　处：《电镀与涂饰》1992年第4期8-14,共7页Electroplating & Finishing

摘　　要：研究了以AB-1为添加剂的酸性硫酸铜浸铜工艺,测定了硫酸铜、硫酸、AB-1添加剂以及温度、时间的变化对置换铜反应速度的影响.并由此确定最佳工艺条件为CuSO_4·5H_2O 120g/L,H_2SO_4110ml/L,AB-1添加剂20ml/L,0-30℃,60-100s.可以获得高结合力半光亮的铜层,浸铜后可以直接镀酸性光亮铜,光亮镍和铬,结合力优于丙烯硫脲浸铜工艺,是取代氰化物预镀铜的新工艺.Immersion copper-plating process with AB-1 additive was studied. Effects of bath ingredient, temperature and immersion time on displacement rate were determined. High adhesive semibright deposit can be obtained from a solution containing CuSO_4·5H_2O 120g/L,H_2SO_4 110ml/L,and AB-1 additive 20 ml/L at 0-30℃ by 60-100 seconds immersion. Acid copper,bright nickel and chromium can be electroplated directly on the as-plated deposit. Adhesion of the deposit is stronger than that from propenyl thiourea immersion copper-plating bath. It would be a substitute process for cyanide copper strike.

关 键 词：浸铜 工艺 镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]