微波集成电路的接口技术与接地技术  

Interface and Ground of Microwave IC

作　　者：刘世刚[1] 

机构地区：[1]机电部第十研究所

出　　处：《电讯技术》1992年第1期52-57,共6页Telecommunication Engineering

摘　　要：本文介绍了微波集成电路接口技术中常用的几种接口技术,及其结构设计方法。对微波集成电路中微带片的接地,屏蔽隔板接地设计也作了一些介绍。应用这些方法,将使电磁兼容效果更加满意。This paper introduces several usual interface techniques of microwave integtated circuit and methods of the structure design. Ground of Microstrip slice in microwave integrated circuit and grounded design of the shield isolation board are also introduced in the paper. Those methods are more satisfactory for electromag- netic compatibility.

关 键 词：电磁兼容 微波集成电路 接口 接地 

分 类 号：TN454[电子电信—微电子学与固体电子学]