石墨颗粒表面化学镀铜研究  

Study on Electroless Copper Plating on Graphite Particles Surfce

作　　者：王贵青[1] 陈敬超[1] 孙加林[2] 

机构地区：[1]昆明理工大学材料与冶金工程学院,云南昆明650093 [2]昆明贵金属研究所,云南昆明650021

出　　处：《表面技术》2003年第1期36-40,共5页Surface Technology

摘　　要：为了充分利用Cu的导电性能,碳石墨的润滑性能,改善Cu/C的润湿性,用化学镀铜的方法成功地对石墨颗粒表面进行镀覆,详细地研究了镀铜液组分及工艺与石墨颗粒表面镀铜层厚度、沉积速度的关系,并得出较好的组分工艺方案,采用优化工艺可以得到平均厚度约7.1μm的镀铜层。同时应用x射线、金相显微镜、扫描电镜及电子探针对镀铜层的厚度、表面形貌、镀铜层与基体的界面进行了全面观察。分析表明,cu/c界面存在过渡层,界面成锯齿状,机械冶金结合的特征十分明显,改善了铜碳界面的相溶性。In order to make most of advantage of electric conductivity of copper and self-lubricate wear-resistant properties of graphite and improve the wetting state between the graphite particle powder and copper metal, graphite particle powder were coated successfully by electroless copper plating method, with emphasis on the influence of electroless components and processing parameters on the thickness, deposition rate of coated copper plating layer, from which achieving optimizing electrolesscopper components and processing parameters, It has been found by X-ray diffraction, electronic microscopy ,TEM that there was a interface between graphite and copper with zigzag microstructure, bonding interface of mechanical and metallurgical is very obvious. The bonding force between the platings and the substrates as well as the main source of the bonding force greatly depend on coarsing processing of pretreatment of graphite powder.

关 键 词：石墨颗粒粉末 化学镀铜 镀铜层厚度 沉积速率 

分 类 号：TQ153[化学工程—电化学工业]