凹槽中化学镀铜  

ELECTROLESS COPPER IN TRENCHES

作　　者：秦毅红[1] 韦顺文[1] 石西昌[1] 王赛[1] 李竹英[1] 

机构地区：[1]中南大学冶金学院,长沙410083

出　　处：《腐蚀与防护》2003年第2期66-69,共4页Corrosion & Protection

摘　　要：通过平面镀铜和凹槽镀铜试验 ,讨论了不同工艺条件下镀铜沉积速度和副反应对镀层性质的影响 ;并对化学镀铜液中各种络合剂和添加剂进行电化学测试分析 ,选择合适的络合剂和添加剂以及相应的条件 。The different complexing agents and surfactants in the solution of electroless copper were tested through comparative blank experiments of electrochemical analysis. The right complexing agents and surfactants were chosen and used to do the research of electroless copper in trenches. The results showed that the complexing agents, surfactants and corresponding process can definitely improve the coverage of electroless copper in trenches.

关 键 词：凹槽 化学镀铜 工艺条件 沉积速度 络合剂 添加剂 

分 类 号：TQ153.14[化学工程—电化学工业]