波导腔体用微波开关二极管封焊工艺的改进  

Improvement on Packaging Process of High Speed Switching Diodes Applied to Wave-guide

作　　者：寇亚男[1] 

机构地区：[1]南京电子器件研究所,江苏南京210016

出　　处：《电子产品可靠性与环境试验》2003年第1期19-21,共3页Electronic Product Reliability and Environmental Testing

摘　　要：从器件的芯片结构及封焊工艺入手,分析了封焊工艺影响成品率的各种原因,并采取相应的改进 措施,提高了器件的成品率。Various factors affecting the yield of packaging process of high speed switching diodes were analyzed on die structure and packaging process of devices, and steps have been taken to improve the yield of the dioldes.

关 键 词：波导腔体 微波开关二极管 封焊 成品率 管芯结构 气密性 

分 类 号：TN31[电子电信—物理电子学]