微透镜列阵与红外探测器列阵集成芯片的研究  

Study on the Integrated Chip of Microlens Array with IR Detector Array

作　　者：杜春雷[1] 邱传凯[1] 邓启凌[1] 潘丽[1] 白临波[1] 王永茹[1] 

机构地区：[1]中国科学院光电技术研究所微细加工光学技术国家重点开放实验室,四川成都610209

出　　处：《光电工程》2003年第1期1-4,共4页Opto-Electronic Engineering

基　　金：国防预研项目

摘　　要：在分析微透镜列阵光聚能原理的基础上,针对背照式256290铂硅红外焦平面探测器列阵 的结构参数,设计了衍射微透镜列阵,使入射光通过硅基底聚焦至探测器的各个光敏面上, 提高光能利用率从而增强探测能力。实验获得了微透镜列阵与红外焦平面集成芯片,并在热成像中取得了良好的结果。On the basis of analyzing light-gathering principle of microlens array, the diffraction microlens array is designed against back-illumination type 256×290 Pt-Si IR focal plane detector array. In this way the incident light can pass through silicon substrate and focus on various sensitive surfaces of detectors. The optical energy utilization ratio can be improved and thus the detection power can also be intensified. The microlens array and IR focal plane integrated chips are obtained in experiments. These chips have achieved good results in thermal imaging.

关 键 词：微透镜列阵 红外探测器 集成芯片 热成像 

分 类 号：TN215[电子电信—物理电子学]