蓝宝石的Ag_(70.5)Cu_(27.5)Ti_2合金活性封接  

Sapphire Joining Using Ag_(70.5)Cu_(27.5)Ti_2 Brazing Filler Metal

作　　者：宁洪龙[1] 黄福祥[1] 马莒生[1] 耿志挺[1] 韩忠德[1] 

机构地区：[1]清华大学,北京100084

出　　处：《稀有金属材料与工程》2003年第3期236-239,共4页Rare Metal Materials and Engineering

摘　　要：在845℃～860℃,6min的真空条件下,采用AgCuTi焊料封接蓝宝石与热等静压99%氧化铝。研究了AgCuTi焊料与蓝宝石界面的反应机理,同时对影响封接结合强度与气密性的因素———氧化铝的表面状况和焊接后的退火进行了分析,得出了控制焊接质量的处理方法。Sapphire and hot-pressed 99% Al2O3 ceramic were joined using Ag70.5Cu20.5Ti2 brazing filler metal at 845degreesC to 860degreesC for 6 min in a vacuum. The interface reaction between the Ag70.5Cu20.5Ti2 alloy and ceramic or sapphire during brazing are reported. The joining strength and the airtight of the specimen are influenced by the surface condition of alumina ceramic as well as the welding factors.

关 键 词：蓝宝石 活性封接 结合强度 漏气速率 银合金 

分 类 号：TG457[金属学及工艺—焊接]