常规热压干法纤维板热压传热的研究 Ⅱ.无胶纤维板热压传热的实用数学模型  

Study of Heat-conduction of Dry-processed Fiberboard by Conventional Hot-pressing Methods∶Ⅱ. Practical Mathematical Model of Fiberboard Heat-conduction by Hot-pressing Methods Without Adhesive

作　　者：谢力生[1] 赵仁杰[2] 张齐生[1] 

机构地区：[1]南京林业大学木工学院,江苏南京210037 [2]中南林学院工业学院,湖南株洲412006

出　　处：《中南林学院学报》2003年第2期66-70,共5页Journal of Central South Forestry University

基　　金：中南林学院青年科学基金项目"常规热压干法纤维板热压传热研究"的部分内容.

摘　　要：　采用常规热压法对没有施加胶粘剂的干法纤维板板坯进行热压,找出了板坯中心层温度的变化规律与板坯含水率、板厚、板材密度及热压温度等的关系,根据实验结果对理想的数学模型进行了修正与完善,建立了无胶干法纤维板板坯中心层温度变化的实用数学模型.By means of conventional hotpressing method, tests of pressing the mat of dryprocessed fiberboard without adhesive were conducted. The relations between the changing regularity of its central layer's temperature and its moisture content, thickness and density of panels, hotpressing temperature, etc. were found out. The mathematical model deduced according to the data obtained from the tests was further revised, and the practical mathematical model with the change of the central layer's temperature (of the mat of dryprocessed fiberboard without adhesive) was established.

关 键 词：无胶纤维板 传热 常规热压法 板坯中心层温度 数学模型 导温系数 胶粘剂 

分 类 号：TS653.6[轻工技术与工程]