基于体硅工艺的静电致动微夹持器制作工艺分析  

Fabrication process analysis for electrostatically actuated microgripper based on silicon bulk micromachining

作　　者：李勇[1] 李玉和[1] 李庆祥[1] 訾艳阳[1] 

机构地区：[1]清华大学精密仪器与机械学系,北京100084

出　　处：《光学精密工程》2003年第2期109-113,共5页Optics and Precision Engineering

基　　金：清华大学机械工程学院985研究基金

摘　　要：介绍了一种基于体硅工艺的大尺寸、大深宽比梳状静电致动微夹持器的制作工艺。对微夹持器制作中的关键工艺进行分析,重点分析ICP蚀刻工艺的蚀刻时间对结构的影响,总结导致器件失效的原因,探讨了减少失效的方法。加工过程中采用分步加工的办法控制蚀刻时间,成功的释放了宽6μm,厚60μm,等效长度达5470μm的悬臂梁型微夹持臂。研制出一种良好性能的具有S形柔性结构夹持臂的梳状静电致动微夹持器。The fabrication process of a comb_drive electrostatically actuated microgripper based on silicon bulk micromachining is described in detail, with the effect of ICP etch time on structure analysed. Some factors causing microgripper failure identified, and advices provided for avoidance of failure. With a fractional ICP etch method used to control the etch time a gripper finger of 6 μm wide and 5 470 μm high was successfully released. A high aspect ratio microgripper with S_shaped flexible fingers has been developed.

关 键 词：体硅工艺 静电致动微夹持器 电感耦合等离子体 蚀刻 制作工艺 微细加工 

分 类 号：TN305[电子电信—物理电子学]