甲磺酸盐光亮镀锡铅合金工艺研究  

Study on Technology of Bright Sn-Pd Acid Alloy Electroplating in Methanesulfonic Acid

作　　者：王爱荣[1] 荆瑞俊[1] 亓新华[1] 陶建中[1] 

机构地区：[1]河南职业技术师范学院,河南新乡453003

出　　处：《表面技术》2003年第3期55-56,共2页Surface Technology

摘　　要：研究了甲磺酸体系光亮镀锡铅合金工艺中各因素对镀层质量的影响 ,同时对镀锡铅合金的厚度。In this article the effects of vanious factors in the technology of bright Sn Pd alloy electroplating in me thanesulfonic acid on the electroplating quality are discussed. At the same time ,in this article the thickness of the Sn Pd alloy and the effect of electroplating countercheck layer on electroplating welding capability are also stated.

关 键 词：镀合金 锡铅合金 甲磺酸盐 可焊性 

分 类 号：TQ153.2[化学工程—电化学工业]