采用不同增强材料的聚酰亚胺覆铜板  

Polyimide Copper Clad Laminates Using Different Reinforcing Material

作　　者：严小雄 李小兰[1] 王金龙[1] 

机构地区：[1]国营第七○四厂研究所,712099

出　　处：《印制电路信息》2003年第4期11-13,15,共4页Printed Circuit Information

摘　　要：本文分析了双马来酰亚胺的性能特点及聚酰亚胺覆铜板的发展趋势。以适当的方法成功地合成了改性双马树脂并采用不同的增强材料制作了三种覆铜板,详细地论述了它们各自性能的优点。The property of Bismaleimide and the development of Polyimide CCL are reviewed in this paper. The modified BMI resin is synthesized in proper way, therefore three different CCL are made with three different reinforcing materials and outlined resin.At the same time we discuss the advantages of their property.

关 键 词：聚酰亚胺 覆铜扳 双马来酰亚胺 发展趋势 印刷电路板 PCB 

分 类 号：TN41[电子电信—微电子学与固体电子学] TN405