电解铜箔表面光亮带产生原因的研究  

Cause of Forming Light Region on Copper Foils Surface

作　　者：涂思京[1] 闫晓东[1] 赵月红[1] 胡国平[1] 

机构地区：[1]北京有色金属研究总院有色金属加工工程研究中心,北京100088

出　　处：《稀有金属》2003年第4期464-466,共3页Chinese Journal of Rare Metals

摘　　要：研究了阴极辊焊缝处组织与电解铜箔表面上形成的光亮带之间的关系。研究发现 ,在电解铜箔生产中 ,阴极辊表面焊缝处组织与基体金属组织晶粒尺寸不同级 ,因此电流在阴极上分布不均匀 ,在相同时间内沉积的铜箔厚度也不均匀 ,厚度差引起铜箔色差 ,形成光亮带 ;从电结晶的角度看 ,焊缝处晶粒尺寸大、分布的电流密度低 ,因此 ,在焊缝处沉积的铜箔的晶粒尺寸也较大 ,焊缝斑被原样复制。The relationship of the welding seam microstructure of the drum cathode and the light region forming on the copper foil surface was studied. It was found that during the electrodepositing process, the grain size of the welding seam and that of the matrix metal is not the same grade so that the current distribution in the cathode is uneven. During the same time the thickness of electrodeposited copper foils is not homogeneous and the thickness difference results in the luster difference on copper foils surface, then the light region appears. According to the theories of electro crystalization, in the welding seam the grain size is bigger and the current density is smaller, so the grain size of copper foils electrodeposited on welding seam is also bigger. Namely, the weld trace is copied.

关 键 词：铜箔 光亮带 阴极辊 哑光处理 电解沉积 电结晶 

分 类 号：TG401[金属学及工艺—焊接]