可加工Ce-ZrO_2/CePO_4陶瓷材料的裂纹扩展及加工损伤  

Crack Propagating and Machining Damage of Machinable Ce-ZrO_2/CePO_4 Ceramic

作　　者：刘志锋[1] 刘家臣[1] 邱世鹏[1] 葛志平[1] 李鸿祥[1] 李益欢[1] 李岩[1] 

机构地区：[1]天津大学材料科学与工程学院,天津300072

出　　处：《材料工程》2003年第7期14-16,19,共4页Journal of Materials Engineering

摘　　要：对可加工Ce-ZrO_2/CePO_4陶瓷材料中裂纹扩展及加工损伤进行了研究。发现其与一般脆性陶瓷中裂纹扩展有所不同,由于CePO_4的加入在基体中形成了弱界面,在荷载作用下弱界面处易形成微裂纹,并发生裂纹的偏转、分支和桥联等形式,使得材料中裂纹的扩展呈现不连续性。而且CePO_4加入量对裂纹扩展和加工损伤具有较大的影响,加入量较小时裂纹扩展不连续性并不明显,加工损伤大,加工困难;加入量较大时裂纹呈发散状态,加工损伤小,但材料性能降低。Crack propagating and machining damage of machinable Ce-ZrO2/CePO4 ceramic is investigated. It is found that the crack propagating in this ceramic, is different to that in others brittle ceramics. Weak interface forms in matrix with the adding of CePO4, where can yield micro-crack and produce crack deflection, branching and bridging, which lead to discontinuity of crack propagating in Ce-ZrO2/CePO4 ceramic. Furthermore,doping content of CePO4 has greatly effect on crack propagating and machining damage, it is not obvious of crack propagating discontinuity with small doping content of CePO4. At the same time, it has a great machining damage and is difficult to machine. On the contrary, samples has a diverge state of crack propagating with massive doping content of Ce-PO4, and has a little machining damage but mechanical properties deteriorate.

关 键 词：可加工 裂纹扩展 弱界面 损伤 

分 类 号：TQ174.1[化学工程—陶瓷工业]