混合集成电路铜功率外壳气密性失效分析  

Failure Analysis of Leakage on Hybrid Integrated Circuit Copper Power Shell

作　　者：耿志挺[1] 马莒生[1] 宁洪龙[1] 黄福祥[1] 

机构地区：[1]清华大学,北京100084

出　　处：《稀有金属材料与工程》2003年第8期650-653,共4页Rare Metal Materials and Engineering

摘　　要：玻璃封接金属管壳是集成电路封装中的1类主要组件,该管壳是将玻璃与可伐合金封接而成的绝缘子钎装在铜管座上制成的。本文研究了PM型混合电路铜功率外壳气密性失效问题,产品高温老化后,气密性可由10-8Pam3/s降到10-5Pam3/s。结合对失效产品的解剖,以及与国外不漏气的同类型功率管的对比分析,分析了影响玻璃封接金属管壳气密性的因素以及生产工艺对封接质量的影响,提出若干改进建议,并指出提高产品质量的有效途径。The package of glass-sealing-to-metal is one sort of main packages in an integrated circuit. It is constructared in the way that the insulator consisting of the glass sealed with Kovar alloy is soldered onto copper tubular base. The failure analysis of PM hybrid integrated circuit copper power shell has been made in the present paper. According to the comparision of our sample with the same sore of sealing power tube from aboard, we put forward some proposals and give the effective way to improve the quality of products.

关 键 词：玻璃封接 绝缘子 气密性 可伐合金 

分 类 号：TN45[电子电信—微电子学与固体电子学]