当前电镀热点  

The Present Electroplating Hot Point

作　　者：蒋宇侨 

机构地区：[1]广东深圳518703

出　　处：《电镀与精饰》2003年第5期13-15,共3页Plating & Finishing

摘　　要：参考了近年来四次国际表面处理会议所发表的的论文,以及1999年至2001年国内外杂志及部分著名表面处理公司说明书的基础上简述了纳米晶电镀、磁性材料镀层、复合镀、化学镀、可焊性镀层、脉冲镀、代铬镀层、特种材料电镀以及环境保护的发展概况。On referring to thesises published on four sessions international surface treatment conference in present years, and referring to articles in journals and technical manuals of some famous surface treatment companies at home and abroad from 1999 to 2001, the general sitaution of development of nanocrystal electroplating, magnetic material coating, composite electroplating, electroless plating, solderable coating, pulse electroplating, coating substituting for chromium coating and electroplating on special materials are briefly described.

关 键 词：电镀 镀层 环境保护 纳米晶电镀 磁性材料镀层 复合镀 化学镀 可焊性镀层 脉冲镀 代铬镀层 特种材料电镀 

分 类 号：TQ153[化学工程—电化学工业]