微桥结构镍膜的弹性模量和残余应力研究  

Investigation of Elastic Modulus and Residual Stress of Nickel Film Microbridges by MEMS Technology

作　　者：陈吉安[1] 杨春生[1] 周勇[1] 丁桂甫[1] 王莉[1] 王明军[1] 张亚民[1] 张泰华[2] 

机构地区：[1]上海交通大学微纳米科学技术研究院薄膜与微细技术教育部重点实验室,上海200030 [2]中国科学院力学研究所非线性力学国家重点实验室,北京100080

出　　处：《微细加工技术》2003年第3期66-71,共6页Microfabrication Technology

基　　金：国家重点基础研究发展规划(973)资助项目(G1999033103)

摘　　要：采用MEMS(MicroelectromechanicalSystems)技术研制了宽度在微米尺度的镍(Ni)膜微桥结构试样。采用纳米压痕仪(Nanoindenter)XP系统的楔形压头测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了Ni膜的弹性模量及残余应力,分别为190GPa和87MPa。与采用纳米压痕仪直接测得的带有硅(Si)基底的Ni膜弹性模量(186.8±7.5)GPa相符合。Microbridge testing method is used to evaluate the elastic modulus and residual stress of metallic films.The microscale width nickle film microbridge samples are fabricated by the MEMS technology. A nanoindenter XP system with a wedge tip is used to apply a line load in order to get the loaddeflection curves of nickel film bridge. Theoretical analysis of the microbridge loaddeflection curve is proposed to evaluate the elastic modulus and residual stress of the films simultaneously. The calculated results based on the experimental measurements show that the average elastic modulus and residual stress for the electroplated nickel films is around 190 GPa and 87 MPa respectively, while the elastic modulus measured by nanoindenter for the same nickel film based on silicon substrate is (186.8±7.5) GPa.

关 键 词：MEMS 镍膜微桥结构 弹性模量 残余应力 纳米压痕仪 

分 类 号：TH-39[机械工程]