硬质合金金刚石涂层工具基体真空渗硼预处理技术研究  

Vacuum Boronizing Pretreatment for Adhesion Enhancement of CVD Diamond Coatings on Cemented Carbide Substrates

作　　者：苗晋琦[1] 宋建华[1] 薛润东[1] 佟玉梅[1] 唐伟忠[1] 吕反修[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《人工晶体学报》2003年第4期371-376,共6页Journal of Synthetic Crystals

基　　金：国家高技术研究与发展计划新材料领域"九五"重大项目 (No 863 715 2 3 8 0 3 )

摘　　要：研究了真空渗硼预处理硬质合金基体的表面组织、形貌、粗糙度 ,并在处理过的硬质合金基体上 ,用强电流直流伸展电弧等离子体CVD法沉积金刚石薄膜涂层。结果表明 ,真空渗硼预处理不仅可以有效地消除或控制钴在金刚石沉积时的不利影响 ,而且还显著粗化硬质合金基体表面。因此 ,提高了金刚石薄膜的质量和涂层的附着力 ,其临界载荷值达到 15 0 0N。The surface structure, morphology and roughness of vacuum boronizing pretreatment cemented carbide substrates were investigated. Diamond films were deposited by means of the high current extended DC arc plasma CVD equipment. The results show that the vacuum boronizing pretreatment method can effectively reduce the diffusion and mobility of Co in cemented carbide substrates and obviously roughen the surface of the cemented carbide. Enhancements both on the quality and adhesion of the diamond coatings were observed.The critical load is up to 1500N.

关 键 词：真空渗硼预处理 金刚石薄膜 附着力 硬质合金 涂层 

分 类 号：TG174.442[金属学及工艺—金属表面处理]