铜铟铋硫对Sn-Ag基无铅焊料性能的影响  

Effect of Cu, In, Bi, S on the Properties of Sn/Ag Based Lead-free Solder

作　　者：林培豪[1] 刘心宇[1] 成钧[1] 

机构地区：[1]桂林电子工业学院,广西桂林541004

出　　处：《电子元件与材料》2003年第10期33-34,共2页Electronic Components And Materials

摘　　要：研究了Cu、In、Bi、S元素对Sn-Ag基无铅焊料熔点和铺展性的影响。结果表明:Sn-Ag-Cu三元合金成分为95.5%Sn3.5%Ag1%Cu时具有较低熔点(215℃)和好的铺展性;加入适量的In可降低Sn-Ag合金的熔点和改善铺展性能;随w(Bi)的增加Sn-Ag-Bi三元合金的熔点降低、铺展性变好;Sn-Ag合金的熔点随w(S)的增加而升高,加入少量S能改善Sn-Ag合金的铺展性。The effect of Cu, In, Bi, S on the melting point and the spread-ability of Sn/Ag based lead-free solder was studied. The results show that the melting point of 215℃ and better spread-ability can be achieved when Sn content is 95.5%, Ag content 3.5% and Cu conten 1%. The melting point can be reduced and the spread-ability improved by adding In appropriately. When Bi content increasing, the melting point of Sn/Ag/Bi ternary alloys rises and the spread-ability goes better; when S content increasing, the melting point of Sn/Ag alloys was rises but the spread-ability of Sn-Ag alloys can be improved by adding certain S content.

关 键 词：Sn—Ag合金 无铅焊料 熔点 铺展性 

分 类 号：TN604[电子电信—电路与系统]