铀表面Cu、Ni-P/Cu镀层研究  

Study on Ni-P/Cu Coatings on U substrates

作　　者：鲜晓斌[1] 吕学超[1] 刘清和[1] 李科学[1] 唐凯[1] 刘卫华[1] 

机构地区：[1]中国工程物理研究院,四川绵阳621900

出　　处：《表面技术》2003年第5期16-19,共4页Surface Technology

摘　　要：　用循环Ar+轰击 磁控溅射离子镀(MSIP)和化学镀分别在U表面上沉积Cu、Ni P/Cu,并采用俄歇电子能谱仪(SAM)、扫描透射电镜(STEM)、电化学实验,研究了其表面、剖面形貌和耐蚀性能,以及U基和镀层界面。结果表明:U上循环Ar+轰击 磁控溅射离子镀Cu结晶细密,界面存在较宽的原子共混区,U表面先溅射沉积Cu镀层,再化学镀非晶态Ni P镀层,能够有效地改善镀层的结合强度。Cu?Ni-P/Cu coatings on U substrates are prepared by repeated Ar+ bombardment-magnetron sputtering ion plated (MSIP) and electroless plating. The surface morphology, cross-section morphology, composition distribution of interfaces between the coatings and substrates, and corrosion resistance have been investigated by Auger electron spectroscopy (AES), scanning transmission electron microscopy(STEM), and electrochemical test respectively. The results show that the surface morphology of Cu coating is made up of dense fine grains. The more wide co-existence interface of Cu coatings and U substrates are obtained by repeated Ar+ bombardment-magnetron sputter ion plated. The adhesive strength of coatings can be improved greatly by the sputtering deposition of Cu followed by plating the amorphous Ni-P coatings.

关 键 词：Ni-P/Cu镀层 组织结构 耐蚀性能 

分 类 号：TQ153.14[化学工程—电化学工业]