声表面波器件压电芯片粘接工艺的可靠性研究  

Research on Reliability of SAW Chip Adhesive Process

作　　者：陈台琼[1] 吴燕[1] 唐代华[1] 

机构地区：[1]四川压电与声光技术研究所,重庆400060

出　　处：《压电与声光》2003年第4期263-266,共4页Piezoelectrics & Acoustooptics

摘　　要：对声表面波(SAW)器件失效模式以及SAW器件粘片分离模式进行了初步分类和探讨。通过对粘片工序几种分离模式的对比试验,总结了一套针对该工序的较为完整的粘片可靠性增长的控制措施。The departure modes for SAW device and chip adhesive process were cataloged and discussed in this paper.Aftere xperimental comparison on several departure modes,a complete controlling measurement is proposed to improve the reliability of the chip adhesion.

关 键 词：声表面波器件 粘接强度 可靠性研究 

分 类 号：TN65[电子电信—电路与系统]