无氰仿金电镀的研究  

Study of imitating gold plating of non-cyanide

作　　者：梁均方[1] 苑星海[1] 

机构地区：[1]嘉应学院化学系,广东梅州514015

出　　处：《应用科技》2003年第10期59-61,共3页Applied Science and Technology

摘　　要：报导了一种用焦磷酸盐代替剧毒氰化物的仿金电镀新工艺.总结出镀层中铜、锌、锡含量不同对仿金镀层色泽的影响,由于镀液中采用了新的络合剂和添加剂,因此本工艺具有阳极溶解性能良好,允许电流密度高,在规定的阴极电流密度下仿金镀层色泽逼真,镀层光亮等优点.A new technique of imitating gold plating by substituting pyrophosphate for toxic ayanide was reported.The effects of copper content,zinc content and tin content on the colour of imitating gold plating layer were discussed.Owing to adopting new complex agent and additive,this new technique has such advantages as good anodic solubility,high allowable current density,real coating colour and bright coating.

关 键 词：无氰仿金电镀 焦磷酸盐 电镀工艺 电流密度 色泽 配方 铜锌锡合金 

分 类 号：TQ153.2[化学工程—电化学工业]