近年来脉冲电镀发展概况  

General development situation of pulse plating in recent years

作　　者：许维源[1] 

机构地区：[1]中国科学院电子学研究所,北京100080

出　　处：《电镀与涂饰》2003年第6期41-44,58,共5页Electroplating & Finishing

摘　　要：综述了80年代末我国双脉冲电镀电源开发成功以来,国内外脉冲电镀发展概况,如脉冲单金属电镀、脉冲合金电镀及复合电镀、脉冲阳极氧化等。简单介绍了脉冲电源在其它领域中的应用。This paper reviewed genera] development situation of pulse plating home and abroad since double pulse plating powers were developed in the end of 1980s, such as single metal pulse plating, alloy and composite pulse plating, pulse anodizing, etc. Moreover, applications of pulse power suppliers in other fields were briefly introduced.

关 键 词：脉冲电镀 脉冲电源 

分 类 号：TG178[金属学及工艺—金属表面处理] TQ153.1[金属学及工艺—金属学]