红外热像技术在微波多芯片组件中的应用  

Application of Infrared Thermography Technology to Microwave Multichip Module

作　　者：房迅雷[1] 姜伟卓[1] 严伟[1] 

机构地区：[1]南京电子技术研究所,南京210013

出　　处：《现代雷达》2004年第1期68-70,共3页Modern Radar

摘　　要：探讨了红外热像技术在微波多芯片组件 (MMCM )中的应用 ,重点描述了其中微波功率芯片、调制芯片和小信号微波放大器芯片组装和互连的热设计、过热点控制、故障诊断以及工艺改进等方面的问题。本文通过红外成像的分析 ,完成了对微波多芯片组件的热设计改进 ,并取得了明显的效果。The application of infrared thermography technology to microwave multi-chip mod ule(MMCM) is discussed in this paper. Especially, the thermal design of packagin g and interconnecting of microwave high power amplifier chip, the control of ov er-heated point for modulation chip and diagnostic technique of small signal am plifier chip are described. According to the analysis of infrared imaging, the thermal design of MMCM is improved, and excellent result is achieved. It is show n that infrared thermography technology is a powerful instrument for improving t he reliability of MMCM.

关 键 词：红外热像技术 微波多芯片组件 MMCM 辐射率 热导率 

分 类 号：TN219[电子电信—物理电子学]