LiNbO_3芯片的无损边缘抛光实验  

Experiment on defect-free edge polishing of LiNbO_3 chips

作　　者：李攀[1] 白满社[1] 邢云云[1] 严吉中[1] 

机构地区：[1]西安飞行自动控制研究所,陕西西安710065

出　　处：《应用光学》2014年第6期1069-1074,共6页Journal of Applied Optics

基　　金：总装十二五规划资助项目(51318020101)

摘　　要：以抛光垫抛光工艺为基础,研究出一套完整的新型无损边缘抛光工艺,成功实现了高精度光纤陀螺集成光学调制器LiNbO3芯片边缘的无损抛光。即在分析LiNbO3芯片边缘抛光过程中棱边损伤产生原因的基础上,提出3条解决措施:控制研抛浆料中的大颗粒;选择低亚表面损伤的抛光方式;抛光颗粒的大小接近或小于临界切削深度的2倍。加工工件棱边在1 500×显微镜下观察无可见缺陷,芯片端面的表面粗糙度Ra≤0.8nm,表面平面度优于λ/2,满足了LiNbO3芯片无损边缘抛光要求。同时,该工艺方法具有较大的推广应用价值。To meet the requirements for defect-free edge polishing of high-precision fiber optic gyroscope integrated optic modulator LiNbO3 chips,a new polishing process based on pad polishing was developed.According to the analysis on the causes for edge damage during the edge polishing,three solutions were presented:controlling the big particles in polishing material,choosing the low sub-face damage polishing and making the particles size close to or less than double of the critical cutting depth.With the new process,the defect-free edge polishing of LiNbO3 chips could be achieved and the results show that the edges under 1 500×microscope have no visible defect,the chip end face roughness Rais less than 0.8nm and the surface flatness reaches better thanλ/2.Additional,this polishing process has great application value.

关 键 词：铌酸锂 集成光学器件 边缘抛光 光纤陀螺 

分 类 号：TN305.2[电子电信—物理电子学]