引线框架铜合金材料研究及开发进展  

Researches and Production Development of Copper Alloy Materials for Lead Frame

作　　者：赵谢群[1] 

机构地区：[1]北京有色金属研究总院科技信息研究所,北京100088

出　　处：《稀有金属》2003年第6期777-781,共5页Chinese Journal of Rare Metals

摘　　要：综述了引线框架用高强高导铜合金的种类、特性要求与目前国内外的研究重点 ,总结了高强高导铜合金的开发趋势 ,展望了其应用在IC封装业的市场前景。The alloy systems, performance requirements and researches situation of the copper alloy materials for lead frame at home and abroad were reviewed. The developing trends of the high strength and high conductivity copper alloy materials were summarized. The application in IC package and the market in prospect of the materials were summarized as well.

关 键 词：集成电路封装 引线框架 铜合金 高强度 高电导率 

分 类 号：TG146.11[一般工业技术—材料科学与工程]