微结构光寻址电位传感器阵列芯片的研制  

Study and fabrication of microstructure array chip based on light addressable potentiometric sensors

作　　者：韩泾鸿[1] 张虹[1] 顾丽波[1] 徐磊[1] 陈绍凤[1] 王利[1] 王蕾[1] 

机构地区：[1]中国科学院电子学研究所传感技术国家重点实验室,北京100080

出　　处：《微纳电子技术》2003年第7期391-394,共4页Micronanoelectronic Technology

摘　　要：详细介绍了采用MEMS技术研制的三维微结构LAPS阵列芯片 ,芯片表面划分成 5× 7个敏感单元 ,其中每个敏感区表面设置 4 0× 4 0个硅尖阵列 ,芯片背面对应地形成光耦合阵列窗口。一个 5× 7矩阵的红外LED作为光源控制的耦合到芯片背面的阵列窗口。给出了LAPS阵列芯片的扫描电镜照片和多种生化参数的光寻址测试结果 ,分析讨论了芯片厚度。The three dimensional microstructure LAPS array chip based on the MEMS technology was introduced in detail. The surface of LAPS chip was of 5×7 sensitive elements, and on each of them were the silicon tips of 40×40 array, the array of optical coupling windows were setup on corresponding backside of the chip. An 5×7 IR LED matrix is used as the light source, which is directed to optical coupling windows on the backside of the chip. This paper presented SEM photo of LAPS array chip and testing results of a variety of biochemical parameter, and discussed the thickness of the chip and the effect of the LAPS curve linearity on the performance of the LAPS system.

关 键 词：微结构 光寻址电位传感器 阵列芯片 微电子机械加工 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]