硅微球轴承接触问题的有限元分析  

FEA of contact problems of silicon micro- ball bearings

作　　者：王振波[1] 王晓力[1] 王犇[1] 

机构地区：[1]北京理工大学机械与车辆学院,北京100081

出　　处：《制造技术与机床》2015年第4期56-60,共5页Manufacturing Technology & Machine Tool

基　　金：国家自然科学基金项目(51275046);高等学校博士学科点专项科研基金(20121101110015)

摘　　要：利用有限元分析软件Abaqus建立了硅微球轴承的有限元模型,采用有限单元法(FEM)对微球与硅滚道的接触问题进行数值求解。考察了微球的不同尺寸和材料对硅微球轴承滚道接触应力的影响。结果表明:随着微球尺寸的增大,滚道表面最大接触压力和滚道内最大Mises应力均减小;随着微球公转速度的增大,微球材料密度对滚道侧壁表面接触压力和侧壁内Mises应力有显著的影响。该研究将为MEMS旋转机械中硅微球轴承的设计提供理论依据。A finite element model of silicon micro- ball bearings is developed by the FEA software Abaqus and the problems of the contact between the micro- ball and the silicon race are numerically solved by the finite element method. Effects of different sizes and materials of the micro- ball on the contact stress of the race and the side wall are investigated. The results show that the maximum contact pressure and Mises stress in the silicon race decrease with the increase of the micro- ball size. In adition,as the rotational speed of the micro- ball increase,the density of the micro- ball can affect the stresses in the side wall immensely. This research provides theoretical basis for the design of silicon micro- ball bearings used in the micro- electromechanical system( MEMS).

关 键 词：硅微球轴承 有限元 接触力学 MEMS 

分 类 号：TH133.3[机械工程—机械制造及自动化]