电子整机三维布线的电磁兼容性预测  

Electromagnetic Compatibility Prediction in Routing of Electronic Equipment

作　　者：高建凯[1] 周德俭[1] 李春泉[1] 

机构地区：[1]桂林电子工业学院,广西桂林541004

出　　处：《电子机械工程》2004年第1期4-7,共4页Electro-Mechanical Engineering

摘　　要：互连线间的电磁耦合 (串扰 )是电子整机内各模块间互连电缆及模块内PCB印制迹线布线电磁兼容设计的主要考虑因素 ,对互连线间的串扰进行了分析 ,并以有限元计算及电路仿真软件为工具进行了电磁兼容性预测。Cross-talk between interconnected wires in routing of electronic device or PCB is an important factor of electromagnetic compatibility(EMC) design. Cross-talk between interconnected wires is analyzed, EMC prediction by using electrical circuit simulator and FEM is presented in this paper.

关 键 词：三维布线 电磁兼容性 串扰 PCB 互连线 等效电路 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN03