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出 处:《材料保护》2004年第2期39-41,共3页Materials Protection
摘 要:为解决当前磷化工艺中存在的高温、多渣等不足 ,通过羟胺类低温磷化促进剂与其他传统磷化促进剂相复配 ,采用正交试验的方法研究了一种新型的低温磷化工艺。试验结果表明 ,羟胺具有优异的促进作用 ,硫酸羟胺是较好的室温促进剂 ,单独使用时的最低用量为 5g/L ,与氯化钠配合使用可大大降低其有效用量 ,最低成膜浓度 2g/L ,并能改善膜层的耐碱性。最佳磷化配方为 :ZnO 10g/L ,HNO3 10mL/L ,H3 PO415mL/L ,HAS 2g/L ,NaClO3 1.0g/L ,有机酸 3.0g/L钼酸钠 0 .0 4g/L ,促进剂A适量 ;酸度比 7~ 12 ;pH值 1~ 2 ;磷化时间 15~ 2 0min ;磷化温度 30℃。磷化膜均匀呈灰黑色 ,膜重 8~ 12g/m2 ,硫酸铜点滴≥ 130s。In order to solve the problems of high temperature and deposits in phosphating process, new low temperature phosphating process that used hydroxylamine sulfate (HAS) and traditional accelerators as mixed accelerator was studied by orthogonal test. Results indicate that HAS exhibits excellent acceleration effect, especially alkali resistance at lower temperature. Combining with sodium chlorate, the threshold concentration of HAS in phosphating solution effectively for film forming reduces from 5 g/L to 2 g/L. Optimal formula includes 10 g/L ZnO, 10 mL/L HNO_3, 15 mL/L H_3PO_4, 2 g/L HAS, 1.0 g/L NaClO_3, 3.0 g/L citric acid, 0.04 g/L molybdate, accelerator A as required. The acidity ratio is 7~12, pH value is 1~2, time is 15~20 min, and temperature is 30 ℃。The phosphating film is black and uniform, that weight is 8~12 g/m^2 and drop corrosion of copper sulfate solution is above 130 s.
分 类 号:TG174.4[金属学及工艺—金属表面处理]
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