准分子激光刻蚀聚碳酸酯材料研究  

Research on Etching Properties of Polycarbonate by KrF Excimer Laser

作　　者：赵泽宇[1] 侯德胜[1] 董小春[1] 杜春雷[1] 

机构地区：[1]中国科学院光电技术研究所微细加工光学技术国家重点实验室,四川成都610209

出　　处：《光电工程》2004年第2期4-7,共4页Opto-Electronic Engineering

摘　　要：准分子激光刻蚀聚合物一般认为是由于聚合物材料吸收光子能量而升温,同时分子链上的 化学键也会因吸收光子能量而断裂。本文在讨论分析了准分子激光烧蚀聚合物机理的基础上,通过对不同能量密度情况下得到的不同烧蚀深度的实验结果进行分析计算,得出聚碳酸酯(PC)材料对波长248nm激光的吸收系数为4.17×104cm-1,能量阈值为49.8 mJ/cm2。Etching polymer with excimer laser is carried out by temperature rising when polymer absorbs photon energy. At the same time the chemical bonds on molecular chains will be broken by absorbing photon energy. On the basis of discussing excimer laser etching polymer mechanism, through analyzing and calculating the experimental results of the different etching depths obtained under the different energy densities, we have obtained that the absorption coefficient of polycarbonate for 248nm laser is 4.17104cm-1 and energy threshold is 49.8mJ/cm2.

关 键 词：准分子光刻 聚碳酸酯 激光烧蚀 

分 类 号：TN305.7[电子电信—物理电子学]