热声焊机的研制及工艺研究  

Design and Development of Ultrasonic/Thermosonic Soldering Equipment

作　　者：董永谦[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2004年第2期84-85,88,共3页Electronics Process Technology

摘　　要：热声焊技术可实现金丝的高质量焊接。论述了热声焊设备的研制,介绍了超声系统、机械系统、控制系统等及工艺研究。该设备已应用于微波组件的制造及其相关工艺的研究。Ultrasonic/thermosonic soldering technology is a reliable method for gold wires.Discuss overall project for design of ultrasonic/thermosonic soldering equipment,and introduce ultrasonic system,mechanical system,electric control system of the equipment and research of process technology.In addition,the equipment has applied to the manufacture of microwave devices and research of process technology for microwave devices.

关 键 词：热声焊 楔焊 封装 设备 

分 类 号：TG439[金属学及工艺—焊接]