Si_3N_4复相陶瓷半固态连接的接头组织和界面反应  

Solid-liquid State Bonding of Si_3N_4 Ceramics:Microstructures and Interfacial Reactions

作　　者：杨俊[1] 吴爱萍[1] 邹贵生[1] 张德库[1] 刘根茂[1] 任家烈[1] 

机构地区：[1]清华大学机械工程系,北京100084

出　　处：《材料科学与工程学报》2004年第2期157-160,共4页Journal of Materials Science and Engineering

基　　金：国家自然科学基金资助项目 (50 0 750 4 6)

摘　　要：根据复合材料的强化原理 ,用Ag Cu Ti钎料和TiN颗粒作为复合连接材料在半固态下连接Si3N4复相陶瓷以提高接头强度 ,研究了接头的组织和界面反应。结果表明 ,接头由母材 反应层 含微量Ti的Ag Cu +TiN 反应层 母材组成 ,反应层由含Ti、Si、N三种元素的一些化合物组成 ;TiN颗粒在Ag Cu基体中的分布总体均匀 ,两者之间的界面清晰、结合致密 :当TiN的加入量较小时 ,对连接材料与母材的界面反应没有明显影响。初步的剪切试验结果表明 ,采用Ag Cu Ti加TiN颗粒作为复合连接材料连接Si3N4Based on the reinforcement principles of composite materials,solid-liquid state bonding of Si-3N-4 ceramics was achieved with the composite bonding materials composed of Ag-Cu-Ti foils and TiN particulates to enhance the strength of joints.Microstructures and interfacial reactions of the joints were investigated.The results showed that the joint comprises substrate/reaction layer/Ag-Cu eutectic base containing little Ti+TiN/reaction layer/substrate.TiN particulates are generally well dispersed in the Ag-Cu eutectic base,and the interface between them is both clean and tight.Meanwhile,when ranging from 0 to 20%,the change in the volume of TiN particulates exerts no noticeable effects on the interfacial reaction between the Ag-Cu-Ti and the substrates.Preliminary results of shearing tests indicated that bonding of Si-3N-4 ceramics with the composite bonding materials discussed in this paper is capable of improving the strength of joints.

关 键 词：复合连接材料 Si3N4复相陶瓷 半固态连接 接头组织 界面反应 AG-CU-TI钎料 TiN颗粒 

分 类 号：TQ174.758[化学工程—陶瓷工业] TG407[化学工程—硅酸盐工业]