低游离醛高密度模压门面板的开发研制  

Development of high-density molded door skin with low free CHCO

作　　者：曹绪英 宋志磊 元光喜 全中华 韩喜玉 

机构地区：[1]吉林省桦甸惠邦木业有限责任公司,吉林吉林132400

出　　处：《吉林林业科技》2004年第2期34-38,共5页Journal of Jilin Forestry Science and Technology

摘　　要：利用酚醛树脂胶粘剂生产高密度模压门面板,施胶量控制在210kg/ ,纤维含水率控制在10%,热压温度控制在210℃,热压时间控制在230s,采用HBJ-01添加剂,其产品各项指标符合有关要求。The test shows following results to develop high-density molded door skin using phenol aldehyde resin adhesive: Glue blending quantity should be controlled 210 kg·m^(-3), fiber moisture content at 10 percentage, hot- pressing temperature at 210℃,hot-pressing time at 230 s and HBJ-01additive was the best for which.

关 键 词：酚醛树脂胶粘剂 高密度模压门面板 甲醛释放量 纤维含水率 施胶量 热压温度 

分 类 号：TS653[轻工技术与工程]