酸性硫酸铜镀液中氯离子的测定  

Determination of chloric ions in acidic copper plating

作　　者：典平鸽[1] 马照民[1] 焦桂枝[1] 

机构地区：[1]平顶山工学院环境工程系,河南平顶山467001

出　　处：《商丘师范学院学报》2004年第2期125-127,共3页Journal of Shangqiu Normal University

摘　　要：酸性光亮镀铜工艺发展已久.由于镀液中氯离子含量对镀层光亮度和阳极行为有较大的影响.一般要求其浓度在20～80mg/L.对镀层中如此低含量氯离子的测定方法有:比色测定法、选择电极法、硫氰化钾回滴法等,但这些方法均有一定的缺点.作者根据实际,得出用AgNO3溶液和Hg(NO3)2溶液分析镀铜液中Cl-离子的方案和适当的温度条件.该法较其他方法有明显的优点.Acidic-copper planting technics has been developed for a long time.Because the concentration of the chloric ions in the planting solution has a comprehensive effect on the lightness of the cladding material and the behavior of the anode,the concentration of the chloric ions should be in the range of 20 to 80 mg/L.There are many methods for the determination of the so low chloric ions content,such as colorimetry,selective electrode,potassium pyrosulfite return titration.But every method has its own disadvantages.After a series of experiments,the author has determined the method,using AgNO_3 and Hg(NO_3)_2 as the accretion,to determine the concentration of the chloric ions in the copper planting solution.It is obviously that this method has more advantages than others.

关 键 词：酸性硫酸铜 氯离子 测定 镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]