BaTiO_3系PTC热敏电阻溅射电极的微观结构  

Microstructure of Electrode Sputtered on BaTiO_3-based PTC Thermistors

作　　者：龚树萍[1] 赵加强[1] 周东祥[1] 

机构地区：[1]华中科技大学电子科学与技术系,湖北武汉430074

出　　处：《电子元件与材料》2004年第5期29-31,38,共4页Electronic Components And Materials

摘　　要：通过对磁控溅射工艺制备的BaTiO_3系PTC热敏电阻电极的研究,发现在瓷片表面沉积镍或铝,无需热处理即可与瓷片形成良好的欧姆接触,并实现了电极与瓷片间良好的附着。利用扫描电镜对溅射形成的镍层进行观察,发现溅射成膜属于层核生长型,晶粒无择优取向,膜层致密,厚度均匀,与瓷片接触紧密,并与瓷片表面形貌有着较好的一致性。但与化学镀镍工艺制备的镍层相比,晶粒大小不够均匀。By magnetron sputtering technology, good ohmic contact and good adhesion between BaTiO_3-based PTC thermistor ceramics and sputtered electrodes of Al or Ni can be achieved without heat treatment. SEM photos show that sputtered film is of perfect crystals. The experimental results, including crystal grain growth mechanism are also discussed.

关 键 词：BaTiO3系PTC热敏电阻 溅射电极 微观结构 欧姆接触 

分 类 号：TN373[电子电信—物理电子学]