环氧树脂及其增强材料回顾  

A Review and Prospect of Resin Material and Reinforcements

作　　者：张伯兴[1] 

机构地区：[1]江南计算技术研究所,213084

出　　处：《印制电路信息》2004年第5期14-20,28,共8页Printed Circuit Information

摘　　要：本文回顾了PCB制造常用的环氧树脂及其增强材料的性能和用途。同时,还介绍了代用树脂材料和代用增强材料的最新进展,如改性环氧树脂、无卤树脂、Thermount、PTFE、氰酸酯等,并就其性能进行了探讨。In this paper, the performance and use of the epoxy material and reinforcements usually used in PCB manufacturing process are reviewed. Meanwhile, the latest progress of the alternative resins and alternative reinforcements, such as modified epoxy, halogen-free resins, Cyanate, PTFE, Thermount, and so on, are introduced .And the performances are also discussed.

关 键 词：环氧树脂 PCB 增强材料 玻璃布 介电常数 介电损耗 无卤树脂 环氯树脂 氰酸酯 

分 类 号：TN405[电子电信—微电子学与固体电子学]