原位生成法半固态连接Si_3N_4复相陶瓷的接头组织  

Joints in Si_3N_4 ceramics bonded using solid-liquid state bonding with intermetallic compounds formed in situ

作　　者：张德库[1] 吴爱萍[1] 邹贵生[1] 刘根茂[1] 杨俊[1] 任家烈[1] 

机构地区：[1]清华大学机械工程系,北京100084

出　　处：《清华大学学报（自然科学版）》2004年第5期613-615,619,共4页Journal of Tsinghua University(Science and Technology)

基　　金：国家自然科学基金资助项目(50075046)

摘　　要：为探索陶瓷材料的有效连接途径,提出一种原位生成增强颗粒的半固态钎焊陶瓷材料方法。采用自制钎料对Si3N4复相陶瓷进行钎焊试验。采取分步焊接的方法,在1023K下使钎缝内生成一定数量的AlCu2Ti金属间化合物,然后在1173K下对陶瓷材料进行半固态连接。显微观察表明:钎缝组织由低熔点的钎料基体和高熔点的金属间化合物组成,金属间化合物均匀分布在钎料基体中,有利于改善接头性能,降低接头的热膨胀不均匀性。A solid-liquid bonding method was developed for ceramics formed in situ with reinforcing particulates to explore an effective way to bond ceramics. Si3N4 ceramics were brazed with self-made bonding materials. The bonding was conducted in two steps with some intermetallic AgCu2Ti first formed in the weld at a relatively low temperature and then solid-liquid state bonding of the ceramics achieved at a higher temperature. Scanning electron microscopic photographs of the microstructure show that the welds are composed of a base of low melting-point bonding materials and higher melting-point intermetallic compounds. The intermetallic compounds are homogeneously distributed in the matrix so they contribute to the decrease in thermal expansion mismatching and the improved joint properties.

关 键 词：原位生成法 半固态连接 SI3N4 复相陶瓷 接头组织 钎焊 

分 类 号：TB321[一般工业技术—材料科学与工程] TG454[金属学及工艺—焊接]