高速化学镀铜工艺  

High Speed Electrolessplating of Cu

作　　者：王丽丽 

出　　处：《表面技术》1993年第6期260-262,共3页Surface Technology

摘　　要：含有兼作络合剂和加速剂的三烷基醇胺和改善镀层物性的添加剂化学镀铜溶液可以获得高的沉积速度,镀层性能优良。An electroless copper plating solution is introduced.It comprises a trialkauolmonoamine as a complexing agent and accelerator and an additive for improving the physical properties of the plat- ing film.In this solution a higher depositing speed can obtained and the physical properties of the plating film are much better.

关 键 词：化学镀铜 高速镀 络合剂 

分 类 号：TQ153.14[化学工程—电化学工业]