光热激励硅微谐振式压力传感器敏感结构热梯度分布研究  

Research on Thermal Gradient Distribution of Sensitive Structure of Photothermal Excited Silicon Microresonant Pressure Sensor

作　　者：王海榕 王亿文 史慧超 

机构地区：[1]北京化工大学信息科学与技术学院,北京

出　　处：《仪器与设备》2023年第4期388-393,共6页Instrumentation and Equipments

摘　　要：本文以硅谐振式压力传感器为研究对象,建立了光热激励硅谐振敏感结构的有限元分析模型,通过ANSYS仿真分析研究了硅谐振敏感结构光热激励方式的动态热分布,揭示了光热激励产生的热量在谐振梁厚度方向激励振动的原因,仿真分析获得了光热激励产生的交流热分量在谐振梁不同方向上的温度梯度分布,为光热激励谐振梁敏感结构设计与优化提供了参考。This paper takes the silicon resonant pressure sensor as the research object, establishes a finite element analysis model of the photothermal excitation of the silicon resonance sensitive structure, and studies the dynamic heat distribution of the photothermal excitation of the silicon resonance sensitive structure through ANSYS simulation analysis, revealing the optical the reason why the heat generated by thermal excitation excites vibration in the thickness direction of the resonant beam. The simulation analysis obtained the temperature gradient distribution of the AC heat com-ponent generated by photothermal excitation in different directions of the resonant beam, which provides information for the design and optimization of sensitive structures of photothermal ex-citation resonant beams.

关 键 词：压力传感器 谐振梁 光热激励 温度梯度 

分 类 号：TP2[自动化与计算机技术—检测技术与自动化装置]