Project supported by the National Science and Technology Major Project of China(Grant No.2015ZX03001004);the National Natural Science Foundation of China(Grant Nos.61604113,61625403,61334003,61376039,61574104,and 61474088)
Based on the complex effective conductivity method, a closed-form expression for the internal impedance of mixed carbon nanotube (CNT) bundles, in which the number of CNTs for a given diameter follows a Gaussian dis...
Project supported by the National Basic Research Program of China(Grant No.2014CB339900);the National Natural Science Foundation of China(Grant Nos.61376039,61334003,61574104,and 61474088)
In this paper,ground-signal-ground type through-silicon vias(TSVs) exploiting air gaps as insulation layers are designed,analyzed and simulated for applications in millimeter wave.The compact wideband equivalent-cir...
Project supported by the National Natural Science Foundation of China(Nos.61474087,61322405,61376039)
The design of a router in a network-on-chip (NoC) system has an important impact on some perfor- mance criteria. In this paper, we propose a low overhead load balancing router (LOLBR) for 2D mesh NoC to enhance ro...
Project supported by the National Natural Science Foundation of China(Nos.61474087,61322405,61376039)
The bufferless router emerges as an interesting option for cost-efficient in network-on-chip (NoC) de- sign. However, the bufferless router only works well under low network load because deflection more easily occur...
Project supported by the National Natural Science Foundation of China(Grant Nos.61131001,61322405,61204044,61376039,and 61334003)
Through-silicon-via (TSV) to TSV crosstalk noise is one of the key factors affecting the signal integrity of three- dimensional integrated circuits (3D ICs). Based on the frequency dependent equivalent electrical ...